Home xin What are the listed companies doing packaging

What are the listed companies doing packaging

by admin
Home xin What are the listed companies doing packaging

What are the listed companies doing packaging

by admin

Tongfu micro electronics (002156): the company is mainly engaged in the packaging and testing business of integrated circuits. It is a packaging and testing manufacturer in China that now realizes the quantitative production of high-end packaging and testing skills MCM and MEMS, and its skills and strength are beyond the position

2. Changdian Technology (600584): the company is the largest semiconductor packaging production base in China. It is a famous transistor and integrated circuit manufacturer in China. The product quality is beyond that in China

it has three key skill R & D platforms for IC that keep pace with international progress, forming an annual production capacity of 7.5 billion integrated circuits, 25 billion large, medium and small power transistors and 1.2 million discrete device chips. It has become the largest semiconductor packaging and testing enterprise in China

3. Huatian Technology (002185): the company is mainly engaged in the packaging and testing business of semiconductor integrated circuits and semiconductor components. It is one of the key integrated circuit packaging and testing enterprises in China

the packaging ability and skill level of the company ranks third among domestic enterprises. It is the largest integrated circuit packaging base in Western China and a modern high-tech enterprise with rich innovation energy

4. Taiji industry (600667): the Hynix large-scale integrated circuit packaging and testing project with an investment of US $350 million can form a production supporting capacity of 120000 12 inch wafers and 75 million 12 inch wafers per month

Taiji industry participated in the project and will change from today’s simple business model to a dual main business model including integrated circuit packaging and testing& nbsp; & nbsp;

5. Suzhou gutechnetium (002079): the company’s main products are all kinds of semiconductor diodes (excluding photodiodes). It has comprehensive abilities in diode wafer and chip planning and manufacturing, diode packaging and testing, and retains the top 10 positions in the domestic semiconductor discrete device industry and surpassing positions in the diode industry

extended data:

Introduction to technology

packaging also refers to the shell for installing semiconductor integrated circuit chips. It not only plays the role of placing, fixing, sealing, protecting chips and enhancing thermal conductivity

and it is also a bridge between the internal world of the chip and the external circuit – the contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected with other devices through wires on the printed circuit board. Therefore, for many integrated circuit products, packaging technology is a very key link

the CPU package used is mostly packaged with insulating plastic or ceramic materials, which can seal and improve the electrothermal performance of the chip. Because the internal frequency of the processor chip is higher and higher, the function is stronger and stronger, the number of pins is more and more, and the shape of the package is also changing

precautions

1. The ratio of chip area to package area should be as close as possible to 1:1 in order to improve the package efficiency

2. The pins should be as short as possible to reduce the delay, and the distance between the pins should be as far as possible to ensure no interference with each other and improve the performance

3. Based on the requirements of heat dissipation, the thinner the package, the better

as an important part of the computer, The performance of CPU directly affects the overall performance of computer. The last and most critical step of CPU manufacturing process is the packaging technology of CPU. There is a large gap in the performance of CPUs with different packaging technologies. Only high-quality packaging technology can produce perfect CPU products

reference: Baidu Encyclopedia – packaging technology

packaging companies include chip packaging, LED packaging and integrated circuit packaging

Datang Telecom (600198), Tongfang Co., Ltd. (600100), St Huke (600608)

chip packaging: Shanghai Beiling (600171), Changdian Technology (600584), Huatian Technology (002185), Taiji industry (600667), Suzhou solid technetium (002079), Youyan silicon stock (600206)

LED packaging: Changdian Technology (600584), BOE a (000725) Chunlan Co., Ltd. (600854), Aucma (600336), Garbo group (600622)

extended data: packaging is the process of assembling integrated circuits into the final products of chips. In short, it is to put the die produced by foundry on a substrate that plays a bearing role and lead out the pins, Then fix the package as a whole

reference: the future development direction of nine LED packaging listed enterprises — snowball

chip packaging:

1 Tongfu micro electronics (002156): the company is mainly engaged in the packaging and testing business of integrated circuits. It is a packaging and testing manufacturer in China that now realizes the quantitative production of high-end packaging and testing skills MCM and MEMS. Its skills and strength are beyond the position. The company is an IC packaging and testing OEM enterprise, which accepts the entrusted orders of chip planning or manufacturing enterprises in the form of processing with supplied materials, provides them with packaging and testing services, and collects processing fees according to the packaging volume. Its IC packaging and testing scope is in the forefront among domestic holding enterprises& nbsp; & nbsp; & nbsp;

2. Changdian Technology (600584): the company is the largest semiconductor packaging production base in China. It is a famous transistor and integrated circuit manufacturer in China. The product quality is beyond that in China. It has three key skill R & D platforms for IC that keep pace with international progress skills, forming an annual production capacity of 7.5 billion integrated circuits, 25 billion large, medium and small power transistors and 1.2 million discrete device chips. It has become China’s largest semiconductor packaging and testing enterprise and is trying to squeeze out the top five in the world. Some products of the company have been designated as military products by the Commission of science, technology and industry for national defense, It is widely used in aviation, aerospace, military engineering, electronic information, automatic control and other fields& nbsp; & nbsp;& nbsp;

3. Huatian Technology (002185): the company is mainly engaged in the packaging and testing business of semiconductor integrated circuits and semiconductor components. It is one of the key integrated circuit packaging and testing enterprises in China. The packaging ability and skill level of the company ranks third among domestic enterprises. It is the largest integrated circuit packaging base in Western China and a modern high-tech enterprise with rich innovation energy. The company was rated as the most developmental packaging and testing enterprise in China. With the great support of policies and taxes, the company has independently developed a series of IC Packaging skills and entered the high-end category of IC packaging& nbsp; & nbsp; & nbsp;

4. Taiji industry (600667): with the cooperation of Taiji industry and Hynix of Korea, the establishment of a joint-stock company from beginning to end will enable the company to enter the semiconductor integrated circuit furniture with more development and growth prospects, and also create an opportunity for the transformation of the company’s furniture organization in the future. The Hynix large-scale integrated circuit packaging and testing project with an investment of US $350 million can form a production supporting capacity of 120000 12 inch wafers and 75 million 12 inch wafers per month. Taiji industry’s participation in the project will change from today’s simple business model to a dual main business model including integrated circuit packaging and testing& nbsp; & nbsp; & nbsp;

5. Suzhou gutechnetium (002079): the company’s main products are all kinds of semiconductor diodes (excluding photodiodes). It has comprehensive abilities in diode wafer and chip planning and manufacturing, diode packaging and testing, and retains the top 10 positions in the domestic semiconductor discrete device industry and surpassing positions in the diode industry. The company increased the investment in QFN packaging products, a product with higher skill content and gross profit margin, so that the company gradually changed from a simple semiconductor discrete device manufacturer to an integrated circuit packaging enterprise. The company is the first enterprise to engage in QFN packaging competition and realize home ownership in China. Now it can produce all kinds of QFN /DFN integrated circuit products. It is the largest QFN /DFN integrated circuit packaging enterprise in China& nbsp; & nbsp; & nbsp;

6. Kangqiang Electronics (002119): the company is mainly engaged in the production of lead frames and bonding wires for semiconductor packaging. The sales volume of the company’s lead frames ranks first in the industry and the sales volume of bonding alloy wires ranks second in the industry. The coverage rate in the world is as high as 60%, and it is a subdivision leader in the electronic field. The company’s integrated circuit framework, power electronic device framework, appearance mount component framework and TO-92 and to-3p split device framework have been ranked first in China for 11 years, with surpassing positions in the industry& nbsp;

7. Sanjia Technology (600520): the company is mainly engaged in the planning, R & D and production of special molds for semiconductor integrated circuits and special molds for chemical building materials. It is the only mold manufacturing listed company in the two cities, with a strange industry advantage. The production and sales of integrated circuit plastic packaging molds and plastic profile extrusion molds produced by the company are the first in the world, and the domestic market share is more than 15% and 30% respectively. Now it has an annual production capacity of 1500 sets of extrusion molds for chemical building materials, 100 sets /set of extrusion despicable settings, 200 sets of semiconductor plastic packaging presses, 200 sets of semiconductor plastic packaging molds, 60 sets of semiconductor automation (rib cutting molding) packaging and 4 billion integrated circuit lead frames& nbsp; & nbsp;& nbsp;

extended data:

encapsulation is to combine the abstract data and behavior (or function) to form an organic whole, that is, organically combine the data with the source code of operating data to form a “class”, in which both data and function are members of the class

is a processing method that maps the transmitted data structure into another data structure in order to realize various data transmission

reference: encapsulation Encyclopedia

packaging companies include chip packaging, LED packaging and integrated circuit packaging
the listed companies of chip packaging are introduced in detail here, and the listed companies of LED packaging are introduced briefly

chip packaging:
[1], Tongfu micro electronics (002156): the company is mainly engaged in the packaging and testing business of integrated circuits. It is a packaging and testing manufacturer in China that now realizes the quantitative production of high-end packaging and testing skills MCM and MEMS, and its skills and strength are beyond the position. The company is an IC packaging and testing OEM enterprise, which accepts the entrusted orders of chip planning or manufacturing enterprises in the form of processing with supplied materials, provides them with packaging and testing services, and collects processing fees according to the packaging volume. Its IC packaging and testing scope is in the forefront among domestic holding enterprises

[2], Changdian Technology (600584): the company is the largest semiconductor packaging production base in China. It is a famous transistor and integrated circuit manufacturer in China, and its product quality is beyond that in China. It has three key skill R & D platforms for IC that keep pace with international progress skills, forming an annual production capacity of 7.5 billion integrated circuits, 25 billion large, medium and small power transistors and 1.2 million discrete device chips. It has become China’s largest semiconductor packaging and testing enterprise and is trying to squeeze out the top five in the world. Some products of the company have been designated as military products by the Commission of science, technology and industry for national defense, It is widely used in aviation, aerospace, military engineering, electronic information, automatic control and other fields

[3]. Huatian Technology (002185): the company is mainly engaged in the packaging and testing business of semiconductor integrated circuits and semiconductor components. It is one of the key integrated circuit packaging and testing enterprises in China. The packaging ability and skill level of the company ranks third among domestic enterprises. It is the largest integrated circuit packaging base in Western China and a modern high-tech enterprise with rich innovation energy. The company was rated as the most developmental packaging and testing enterprise in China. With the great support of policies and taxes, the company has independently developed a series of IC Packaging skills and entered the high-end category of IC packaging

[4]. Taiji industry

Related Posts

Leave a Comment

Tongfu micro electronics (002156): the company is mainly engaged in the packaging and testing business of integrated circuits. It is a packaging and testing manufacturer in China that now realizes the quantitative production of high-end packaging and testing skills MCM and MEMS, and its skills and strength are beyond the position

2. Changdian Technology (600584): the company is the largest semiconductor packaging production base in China. It is a famous transistor and integrated circuit manufacturer in China. The product quality is beyond that in China

it has three key skill R & D platforms for IC that keep pace with international progress, forming an annual production capacity of 7.5 billion integrated circuits, 25 billion large, medium and small power transistors and 1.2 million discrete device chips. It has become the largest semiconductor packaging and testing enterprise in China

3. Huatian Technology (002185): the company is mainly engaged in the packaging and testing business of semiconductor integrated circuits and semiconductor components. It is one of the key integrated circuit packaging and testing enterprises in China

the packaging ability and skill level of the company ranks third among domestic enterprises. It is the largest integrated circuit packaging base in Western China and a modern high-tech enterprise with rich innovation energy

4. Taiji industry (600667): the Hynix large-scale integrated circuit packaging and testing project with an investment of US $350 million can form a production supporting capacity of 120000 12 inch wafers and 75 million 12 inch wafers per month

Taiji industry participated in the project and will change from today’s simple business model to a dual main business model including integrated circuit packaging and testing& nbsp; & nbsp;

5. Suzhou gutechnetium (002079): the company’s main products are all kinds of semiconductor diodes (excluding photodiodes). It has comprehensive abilities in diode wafer and chip planning and manufacturing, diode packaging and testing, and retains the top 10 positions in the domestic semiconductor discrete device industry and surpassing positions in the diode industry

extended data:

Introduction to technology

packaging also refers to the shell for installing semiconductor integrated circuit chips. It not only plays the role of placing, fixing, sealing, protecting chips and enhancing thermal conductivity

and it is also a bridge between the internal world of the chip and the external circuit – the contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected with other devices through wires on the printed circuit board. Therefore, for many integrated circuit products, packaging technology is a very key link

the CPU package used is mostly packaged with insulating plastic or ceramic materials, which can seal and improve the electrothermal performance of the chip. Because the internal frequency of the processor chip is higher and higher, the function is stronger and stronger, the number of pins is more and more, and the shape of the package is also changing

precautions

1. The ratio of chip area to package area should be as close as possible to 1:1 in order to improve the package efficiency

2. The pins should be as short as possible to reduce the delay, and the distance between the pins should be as far as possible to ensure no interference with each other and improve the performance

3. Based on the requirements of heat dissipation, the thinner the package, the better

as an important part of the computer, The performance of CPU directly affects the overall performance of computer. The last and most critical step of CPU manufacturing process is the packaging technology of CPU. There is a large gap in the performance of CPUs with different packaging technologies. Only high-quality packaging technology can produce perfect CPU products

reference: Baidu Encyclopedia – packaging technology

packaging companies include chip packaging, LED packaging and integrated circuit packaging

Datang Telecom (600198), Tongfang Co., Ltd. (600100), St Huke (600608)

chip packaging: Shanghai Beiling (600171), Changdian Technology (600584), Huatian Technology (002185), Taiji industry (600667), Suzhou solid technetium (002079), Youyan silicon stock (600206)

LED packaging: Changdian Technology (600584), BOE a (000725) Chunlan Co., Ltd. (600854), Aucma (600336), Garbo group (600622)

extended data: packaging is the process of assembling integrated circuits into the final products of chips. In short, it is to put the die produced by foundry on a substrate that plays a bearing role and lead out the pins, Then fix the package as a whole

reference: the future development direction of nine LED packaging listed enterprises — snowball

chip packaging:

1 Tongfu micro electronics (002156): the company is mainly engaged in the packaging and testing business of integrated circuits. It is a packaging and testing manufacturer in China that now realizes the quantitative production of high-end packaging and testing skills MCM and MEMS. Its skills and strength are beyond the position. The company is an IC packaging and testing OEM enterprise, which accepts the entrusted orders of chip planning or manufacturing enterprises in the form of processing with supplied materials, provides them with packaging and testing services, and collects processing fees according to the packaging volume. Its IC packaging and testing scope is in the forefront among domestic holding enterprises& nbsp; & nbsp; & nbsp;

2. Changdian Technology (600584): the company is the largest semiconductor packaging production base in China. It is a famous transistor and integrated circuit manufacturer in China. The product quality is beyond that in China. It has three key skill R & D platforms for IC that keep pace with international progress skills, forming an annual production capacity of 7.5 billion integrated circuits, 25 billion large, medium and small power transistors and 1.2 million discrete device chips. It has become China’s largest semiconductor packaging and testing enterprise and is trying to squeeze out the top five in the world. Some products of the company have been designated as military products by the Commission of science, technology and industry for national defense, It is widely used in aviation, aerospace, military engineering, electronic information, automatic control and other fields& nbsp; & nbsp;& nbsp;

3. Huatian Technology (002185): the company is mainly engaged in the packaging and testing business of semiconductor integrated circuits and semiconductor components. It is one of the key integrated circuit packaging and testing enterprises in China. The packaging ability and skill level of the company ranks third among domestic enterprises. It is the largest integrated circuit packaging base in Western China and a modern high-tech enterprise with rich innovation energy. The company was rated as the most developmental packaging and testing enterprise in China. With the great support of policies and taxes, the company has independently developed a series of IC Packaging skills and entered the high-end category of IC packaging& nbsp; & nbsp; & nbsp;

4. Taiji industry (600667): with the cooperation of Taiji industry and Hynix of Korea, the establishment of a joint-stock company from beginning to end will enable the company to enter the semiconductor integrated circuit furniture with more development and growth prospects, and also create an opportunity for the transformation of the company’s furniture organization in the future. The Hynix large-scale integrated circuit packaging and testing project with an investment of US $350 million can form a production supporting capacity of 120000 12 inch wafers and 75 million 12 inch wafers per month. Taiji industry’s participation in the project will change from today’s simple business model to a dual main business model including integrated circuit packaging and testing& nbsp; & nbsp; & nbsp;

5. Suzhou gutechnetium (002079): the company’s main products are all kinds of semiconductor diodes (excluding photodiodes). It has comprehensive abilities in diode wafer and chip planning and manufacturing, diode packaging and testing, and retains the top 10 positions in the domestic semiconductor discrete device industry and surpassing positions in the diode industry. The company increased the investment in QFN packaging products, a product with higher skill content and gross profit margin, so that the company gradually changed from a simple semiconductor discrete device manufacturer to an integrated circuit packaging enterprise. The company is the first enterprise to engage in QFN packaging competition and realize home ownership in China. Now it can produce all kinds of QFN /DFN integrated circuit products. It is the largest QFN /DFN integrated circuit packaging enterprise in China& nbsp; & nbsp; & nbsp;

6. Kangqiang Electronics (002119): the company is mainly engaged in the production of lead frames and bonding wires for semiconductor packaging. The sales volume of the company’s lead frames ranks first in the industry and the sales volume of bonding alloy wires ranks second in the industry. The coverage rate in the world is as high as 60%, and it is a subdivision leader in the electronic field. The company’s integrated circuit framework, power electronic device framework, appearance mount component framework and TO-92 and to-3p split device framework have been ranked first in China for 11 years, with surpassing positions in the industry& nbsp;

7. Sanjia Technology (600520): the company is mainly engaged in the planning, R & D and production of special molds for semiconductor integrated circuits and special molds for chemical building materials. It is the only mold manufacturing listed company in the two cities, with a strange industry advantage. The production and sales of integrated circuit plastic packaging molds and plastic profile extrusion molds produced by the company are the first in the world, and the domestic market share is more than 15% and 30% respectively. Now it has an annual production capacity of 1500 sets of extrusion molds for chemical building materials, 100 sets /set of extrusion despicable settings, 200 sets of semiconductor plastic packaging presses, 200 sets of semiconductor plastic packaging molds, 60 sets of semiconductor automation (rib cutting molding) packaging and 4 billion integrated circuit lead frames& nbsp; & nbsp;& nbsp;

extended data:

encapsulation is to combine the abstract data and behavior (or function) to form an organic whole, that is, organically combine the data with the source code of operating data to form a “class”, in which both data and function are members of the class

is a processing method that maps the transmitted data structure into another data structure in order to realize various data transmission

reference: encapsulation Encyclopedia

packaging companies include chip packaging, LED packaging and integrated circuit packaging
the listed companies of chip packaging are introduced in detail here, and the listed companies of LED packaging are introduced briefly

chip packaging:
[1], Tongfu micro electronics (002156): the company is mainly engaged in the packaging and testing business of integrated circuits. It is a packaging and testing manufacturer in China that now realizes the quantitative production of high-end packaging and testing skills MCM and MEMS, and its skills and strength are beyond the position. The company is an IC packaging and testing OEM enterprise, which accepts the entrusted orders of chip planning or manufacturing enterprises in the form of processing with supplied materials, provides them with packaging and testing services, and collects processing fees according to the packaging volume. Its IC packaging and testing scope is in the forefront among domestic holding enterprises

[2], Changdian Technology (600584): the company is the largest semiconductor packaging production base in China. It is a famous transistor and integrated circuit manufacturer in China, and its product quality is beyond that in China. It has three key skill R & D platforms for IC that keep pace with international progress skills, forming an annual production capacity of 7.5 billion integrated circuits, 25 billion large, medium and small power transistors and 1.2 million discrete device chips. It has become China’s largest semiconductor packaging and testing enterprise and is trying to squeeze out the top five in the world. Some products of the company have been designated as military products by the Commission of science, technology and industry for national defense, It is widely used in aviation, aerospace, military engineering, electronic information, automatic control and other fields

[3]. Huatian Technology (002185): the company is mainly engaged in the packaging and testing business of semiconductor integrated circuits and semiconductor components. It is one of the key integrated circuit packaging and testing enterprises in China. The packaging ability and skill level of the company ranks third among domestic enterprises. It is the largest integrated circuit packaging base in Western China and a modern high-tech enterprise with rich innovation energy. The company was rated as the most developmental packaging and testing enterprise in China. With the great support of policies and taxes, the company has independently developed a series of IC Packaging skills and entered the high-end category of IC packaging

[4]. Taiji industry

Related Posts

Leave a Comment